Solution:

X- ray lithography:

X-Ray lithography is a modern form of lithography in addition to electron beam lithography. It transfers the geometric patterns from a mask to the surface of the silicon wafer through the use of collimated (parallel) 'x-kays rather than the use of UV light.

Similar to photolithography, the photoresist is applied to the surface of the silicon wafer prior to exposure. However, due to the use of x-rays, the masks wed in this process are thinner than those used in the photolithography process and are designed with unique materials.

Typically x-ray membranes are made of elements with low atomic numbers because cement with high atomic numbers, such as gold, has a high x- Ray mass attenuation coefficient, which means they are able to absorb x-ray radiation.

The membrane allows x- rolls to go through the mask and expose the surface of the silicon wafer. On the membrane, an absorber is placed to take in radiated X-rays and shift them to the proper location.

Similar to e-beam lithography, x-ray lithography uses PMMA as the photoresist, which is able to harden on contact with the x-ray.

The etching process allows unwanted regions in the pattern to be removed. In addition like photolithography, x- ray lithography requires a gap between the mask and the silicon wafer surface