written 5.7 years ago by | • modified 5.7 years ago |
Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology
Marks: 5M
written 5.7 years ago by | • modified 5.7 years ago |
Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology
Marks: 5M
written 5.7 years ago by | modified 5.6 years ago by |
Three principal silicon compounds used in MEMS and microsystems.
1.Silicon dioxide [$sio_2$]
2.Silicon carbide [siC]
3.Silicon nitride [$si_3 N_4$]
1. Silicon dioxide [si$o_2$] :
It is least expensive material to offer good thermal and electrical insulation.
It is used as low cost material for "masks" in micro fabrication processes such as etching, deposition and diffusion.
Used as sacrificial material in "surface micro-machining".
2. Silicon Carbide [siC] :
3. Silicon nitride [s$i_3$$N_4$]
Used as excellent barrier to diffusion to water and ions.
Its ultra strong resistance to oxidation and many etchants make it a superior material for masks in deep etching.
It is used as high strength electric insulators.