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Anisotropic etching of silicon

written 6.0 years ago by hetalgosavi • 1.7k

modified 5.4 years ago by shubhamshukla • 40

mems technology

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written 6.0 years ago by hetalgosavi • 1.7k

Anisotropic etching is easier to control of the etched shape of the substrates.

Disadvantages:

1) Slower in rate of etching (< 1 µm/minute)

2) The rate is temperature – sensitive.

3) Best performance at elevated temperature eg. 1000 C.

Temperature resistive mask materials.

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