Understanding MEMS processes and process Parameter for Cleaning, Growth and Deposition, Ion Implantation and diffusion, Annealing, and lithography. Understanding selection of fab processes based on Applications.

Lithographic tools used in micromachining are often time: from previous generations of equipment designed for the fabrication of electronic circuits.

The equipment’s performance is sufficient to meet the requirements of micromachining, but its price is substantially discounted (reduced).

A few specialized processes, such as anisotropic chemical wet etching, wafer bonding, deep reactive ion etching, sacrificial etching and critical point drying, emerged over the years within the MEMS community and remain limited to micromachining in their application.

Micromachining is parallel (batch) process in which dozens to tens of thousands of identical elements are fabricated simultaneously on the same wafer.

In some processes, dozens of wafer are processed at the same time and key difference is the minimum feature dimension on the order of one micrometer. Which is smaller than the conventional matching.

Silicon micromachining combines adding layers of material over a silicon wafer with etching precise patterns in these layers or in the underlying substrate.