Explain integrated circuit packages.

22views

written 6.5 years ago by

teamques10 ★ 69k

IC packaging can be divided into following:

Surface-mount packages (plastic or ceramics), Chip scale packaging, Bare die, Through-Hole packages

Surface mount packages:

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An …

Create a free account to keep reading this post.

and 3 others joined a min ago.

ADD COMMENT EDIT