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Fabrication of PMOS transistors
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written 6.6 years ago by | • modified 5.7 years ago |
Fabrication of NMOS transistor:-
Diffusion Mask -
The first modification of the device wafers was the application of an oxide layer to serve as a diffusion mask. The target thickness of this mask was 8000 Angstroms and the goal was to make it as uniform and contain as little impurities …