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Difference between Bulk and Surface Micromachining?
1 Answer
written 5.8 years ago by | • modified 5.7 years ago |
Sr No | Bulk Micromachining | Surface Micromachining |
---|---|---|
1 | In this mechanical elements are fabricated by etching away the unwanted part in silicon wafer | In this it is fabricated by building layers on layers |
2 | This creates structures inside a substrate | This creates structures on top of a substrate |
3 | Larger structures are made with bulk micromachining | It is difficult to build larger structures |
4 | Limited to low aspect ratio in geometry as surface dimensions are much greater than depth as height is limited by thickness of silicon wafer | Not constraints by thickness of silicon wafer,so high aspect ratio geometries can be fabricated using surface micromachining |
5 | Straight forward and well documented process | Complex masking design and production |
6 | Sacrificial layer is not required | Etching of sacrificial layer is required |
7 | The process is less expensive but material loss is more | The process is expensive but less material loss |
8 | Mechanical properties are superior | Mechanical properties are good |
9 | Dimensional control is good | Dimensional control is better |
10 | CMOS integration is fair | CMOS integration is good |
11 | It causes a well known phenomenon in the micro electronics industry called undercut | It does not causes undercut problem |
12 | Size is small | Size is smaller |
13 | Typically uses wet etching techniques | It uses dry etching techniques |
14 | Suitable for simple geometry such as thermal sensor,micro machined neuron wells | Suitable for complex geometry such as micro valves and actuators |