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Write short note on Wafer Bonding ?
written 7.1 years ago by gravatar for gawanderagini gawanderagini • 50 modified 3.0 years ago by gravatar for binitamayekar binitamayekar ★ 6.7k
mems technology
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written 3.0 years ago by gravatar for sagarkolekar sagarkolekar ★ 11k

Bonding can be used to assemble individually micromachined components. This offers the possibility of 3D structures which are even thicker than one wafer. Anodic Bonding: Anodic bonding is also called field-assisted thermal bonding, electrostatic bonding, etc. This technique is typically done between a sodium glass and silicon for MEMS. …

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