written 6.7 years ago by | • modified 6.5 years ago |
Subject :- VLSI Design
Topic :- MOS Circuit Design Styles
Difficulty :- Low
written 6.7 years ago by | • modified 6.5 years ago |
Subject :- VLSI Design
Topic :- MOS Circuit Design Styles
Difficulty :- Low
written 6.6 years ago by | • modified 6.6 years ago |
The simplest DRAM cell is the 3T scheme. A 3T DRAM cell has a higher density than a SRAM cell; moreover in a 3T DRAM, there is no constraint on device ratios and the read operation is nondestructive.
In this cell, the storage capacitance is the gate capacitance of the readout device, so making this scheme attractive for embedded memory applications; however, a 3T DRAM shows still limited performance and low retention time to severely limit its use in advanced integrated circuits.
3T DRAM utilizes gate of the transistor and a capacitance to store the data value. When data is to be written, write signal is enabled and the data from the bit line is fed into the cell. When data is to be read from the cell, read line is enabled and data is read through the bit line. 3T DRAM cell occupies less area compared to the 4T DRAM cell