Mumbai University > Electronics Engineering > Sem 8 > MEMS Technology

Marks: 2M

• Wafer bonding processes are used in packaging and to build up more complex structures.
• For example, bulk micromachined devices can be assembled into more complex structures by bonding multiple wafers together.
• Also, microfluidic channels can be formed by DRIE etching the channel in one wafer and bonding a wafer to seal the channel.
• The two categories of wafer bonding processes
• silicon fusion bonding
• Anodic (electrostatic) bonding.
• {Note:for silicon fusion bonding and anodic bonding refer to module 3 notes}